The Nano-Observer AFM microscope is a flexible and powerful AFM. Designed with the ultimate technologies, it combines performance and ease of use. The USB controller offers a real integrated lock-in for better measurement capability (phase detection, Piezo-Response Mode…). A low-noise laser and a pre-alignment system provide simplicity and high resolution on a compact AFM head.

This instrument is fully equipped for a range of sample preparation, microanalysis and nanofabrication applications including automated slice-and-view FIB tomography, electron and ion beam lithography, nanomanipulation, in situ probing, EDS, EBSD and a range of imaging modalities. In addition, the system is equipped with 4 gas injection systems for deposition (Pt, Au, SiOx) and etching (XeF2). This dual-beam FIB/SEM allows simultaneous FIB milling and SEM imaging.

The system consists mainly of a Scanning Electron Microscope (SEM, LEO 1520 system with a Gemini column) integrated with hardware for doing lithographic electron beam exposures. The Raith150 software provide the design for the exposure of the pattern.

This instrument is fully equipped for a range of sample preparation, microanalysis and nanofabrication applications including automated slice-and-view FIB tomography, electron and ion beam lithography, nanomanipulation, in situ probing, EDS, EBSD and a range of imaging modalities. In addition, the system is equipped with 4 gas injection systems for deposition (Pt, Au, SiOx) and etching (XeF2). This dual-beam FIB/SEM allows simultaneous FIB milling and SEM imaging.

With its rapid thermal annealing and brazing capabilities the ATV SRO-700 is equally suited for basic reflow soldering applications by a cold wall chamber principle in combination with the IR lamp heating technology and the vacuum.

DISCO Wafer Saw - DAD3240 - Capable of cutting silicon, glass and quartz substrates up to 8" circles. Substrate which can be diced: Si, glass, quartz and bonded wafers.

FINEPLACER® lambda is a flexible sub-micron die-bonder for precision die attach and advanced chip packaging. The system handles a wide range of applications, including laser bar and diode bonding with Indium or Au/Sn, VCSEL/photo diode bonding (glueing, curing) and the multi-stage assembly of opto electro mechanical systems (i.e. MEMS/MOEMS) for communications and medical technology products.

HB Wire Bonder has a motorized Z-Axis and a motorized Wire Clamp. It allows to use Gold, aluminum, silver and copper wire and ribbon for wedge, ball and ribbon bonding.

Electrical and thermal bonds are at the base of bonding processes. Bond strength measurement allows a precise knowledge of bond strength quality. This bond test system is capable of accurately testing bond wires, solder bumps, dies, leads, chips, lids by Pull and Shear tests.

Probe station equipped with Electrical characterization equipment: I-V source meter, Parameter analyzer, Vector Network Analyzer, LCR meter, multi meter, oscilloscopes.

The MSA-500 Micro System Analyzer is the all-in-one instrument – the only one of its kind in the world – for static and dynamic 3D characterization of MEMS modules and microstructures. By integrating a microscopic lens with scanning laser Doppler vibrometry, stroboscopic video microscopy and white-light interferometry, this micro system analyzer offers you the ideal all-in-one solution that you can use to extensively analyze vibrating microstructures and their topography. You can quickly identify resonance frequencies and have associated deflection shapes and even transient processes visualized in a reliable and clear manner.

The laboratory is equipped for carring on simple operations for electronics and mechanics.